PECVD

MEMS applications demand use a wide range of dielectric film types and requirements are becoming more stringent as MEMS devices become increasingly sophisticated. SPTS’ PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers.

Benefits of SPTS PECVD:

  • High deposition rate SiOx and SiN
  • TEOS for enhanced step coverage
  • Stress tuning by dual RF
  • Dense, low hydrogen SiN films offer lower wet etch rate

 

Suspended SiN MEMS structure SiN stress graph
Suspended MEMS structure
manufactured in low stress
PECVD SiN
Graph illustrating stress control
using RF frequency mixing

 

 

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