SPTS provides highly productive large batch thermal process systems for the fabrication of power semiconductor products on 150, 200 and 300mm wafers.
Benefits of SPTS LPCVD/Diffusion for Power Applications:
- Highly uniform wet/dry thermal SiO2
- Large-batch LPCVD TEOS with excellent step coverage
- >1200°C thermal drive-in annealing
- Low CoO doped and un-doped gap-fill polysilicon
|20:1 AR TEOS trench fill
||Gap-fill LPCVD polysilicon