LPCVD/Diffusion

SPTS provides highly productive large batch thermal process systems for the fabrication of power semiconductor products on 150, 200 and 300mm wafers.

 

Benefits of SPTS LPCVD/Diffusion for Power Applications:

  • Highly uniform wet/dry thermal SiO2
  • Large-batch LPCVD TEOS with excellent step coverage
  • >1200°C thermal drive-in annealing
  • Low CoO doped and un-doped gap-fill polysilicon

 

20:1 aspect ratio TEOS trench fill Gap-fill LPCVD polysilicon
20:1 AR TEOS trench fill Gap-fill LPCVD polysilicon
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