PECVD

The Delta APM is widely used in production for RF-IC semiconductor applications. SPTS develops processes and hardware for smaller wafer sizes for today’s production needs with extendibility to larger wafer sizes, without the need for new hardware. Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment

Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers.

 

Benefits of SPTS PECVD for Compound Semiconductor RF-IC

  • One chamber for all wafer sizes
  • Industry-leading uniformity and repeatability
  • SiN with proven reliability for MIM capacitors
  • High deposition rate SiN with tuneable stress for passivation
  • TEOS-based SiO for enhanced step coverage
  • Low H SiN films

     

APM platen MIM capacitor SiN Repeatability
SPTS APM module

Excellent wafer to wafer repeatability
(less than +/-1.5%)
for deposition rate and thickness using SPTS' PECVD 

 

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