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Orbotech’s

Orbotech’s SPTS Technologies Accelerates Industry Adoption of its Mosaic Plasma Dicing Solution with Order from JCAP Corporation

March 8, 2017
SPTS has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies.
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Orbotech’s

Orbotech’s Emerald™ Laser Via Formation Solution Selected by Huatian for 3D Wafer-Level Packaging Applications

November 28, 2016
Orbotech sells Emerald Laser Via Formation system to Huatian Technology for 3D wafer-level packaging.
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Orbotech’s

Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment

November 2, 2016
SPTS Technologies today announced that it has received an order from NANIUM, S.A. for a 300mm Sigma fxP PVD system to expand NANIUM’S Fan-out Wafer Level Packaging (FOWLP) capacity.
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Orbotech’s

Orbotech’s SPTS Technologies Wins Two 2016 Best Factory Awards and Two Insider Made in Wales Awards

October 27, 2016
SPTS wins four prestigious business awards; Two Best Factory Awards and Two Made in Wales Awards
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Orbotech’s

Orbotech’s SPTS Technologies Collaborates with Novati Technologies to Establish New Plasma Dicing Line

September 7, 2016
SPTS announces its collaboration with Novati Technologies, to establish a new plasma dicing line in Austin, TX.
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