SPTS to supply 300mm technology to new Fraunhofer ASSID center
NEWPORT, UK, May 31, 2010—SPP Process Technology Systems (SPTS), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced that it has received an order for a Pegasus DSi Deep Silicon etch system supported on the Omega fxP cluster platform, for 3D-IC through silicon via (TSV) application from Fraunhofer IZM, to be installed at All Silicon System Integration Dresden (ASSID).
ASSID is a brand new center which has been set up by Fraunhofer IZM Berlin to develop 3D wafer level technologies on 300mm wafers, enabling leading device manufacturers to apply 3D-IC technology in high volume production to enhance the performance, functionality and scaling requirements of their future products. The new 300mm Pegasus DSi system will be used to etch deep through silicon vias (TSV), and for wafer thinning applications.
M. Juergen Wolf, the Coordinator and Manager of Fraunhofer IZM-ASSID explained, “Our new center has a state-of-the-art clean-room facility and SPTS, as a key cooperation partner, provides valuable experience and production-qualified equipment for our 300mm 3D device stacking assembly line. The complete line will include TSV formation, TSV post-processing on wafer frontside and backside, as well as testing and failure analysis.”
“We recognize the significance of IZM’s contributions to definitive TSV technology, and are honoured that Fraunhofer has decided to extend that technological leadership with SPTS,” remarked Susumu Kaminaga, Chairman of SPTS and President of Sumitomo Precision Products (SPP).
Kevin T. Crofton, Managing Director of the Single Wafer Division of SPTS, added, “We’re delighted that Fraunhofer IZM has selected SPTS for this important program. IZM is a long time supporter of our equipment at 200mm, and it is testament to our support and technology that they have chosen to continue that relationship at 300mm. We look forward to helping IZM develop and implement 3D-IC processes inside the new ASSID facility, and ultimately into volume manufacture.”