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SPTS Ships APS Etch System To Fraunhofer ISIT

SPTS Ships APS Etch System To Fraunhofer ISIT 

Newport, United Kingdom — 29 Dec, 2010 — SPP Process Technology Systems (SPTS), a supplier of advanced capital equipment and process technologies for the global semiconductor industry and related markets, today announced that it has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT). The system will add new process capability to ISIT’s MEMS manufacturing line to fuel next generation development of devices such as actuators, sensors and energy harvesters. 

“We have chosen to add APS to extend our offerings to the full range of deep etch processing for all MEMS and related technologies. We are now capable of not only high-performance deep silicon etching, but also for challenging etches in hard materials, such as piezoelectric films, oxide films, glass and Pyrex,” explained Christian Schroeder the MEMS Technology Manager at FhG-ISIT. 

Kevin T. Crofton, executive vice president, and managing director of Single Wafer Division at SPTS said, “We are pleased to strengthen our existing relationship with this important R&D customer. The APS source offers unique processing capabilities with its patent-protected source design, proving to be extremely effective for customers who work with a variety of materials that are difficult to etch using conventional Inductively Coupled Plasma (ICP) tools.”

 

 

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