French Research Institute To Deploy Sigma® fxPTM Physical Vapor Deposition System In Newly-Inaugurated 3D-IC Facility
Newport, United Kingdom — 9 February, 2011 — SPP Process Technology Systems (SPTS), a leading manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today announced it has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor Deposition (PVD) system. The 300mm system will be used for advanced Through-Silicon-Via (TSV) development at Leti’s newly-inaugurated 300mm fab extension in Grenoble, France. This system win comes on the heels of an October 2010 agreement between Leti and SPTS to collaborate on creating next-generation high aspect ratio TSVs. The new Sigma system will join SPTS’ silicon etch and dielectric deposition systems previously selected for this new line.
Leti’s state-of-the-art integration line features a complete suite of the equipment required for research and development on advanced 3D-IC single processes and integration. The Sigma fxP will deposit the diffusion barrier and seed metal layers prior to the final Cu electroplating via fill process. Using SPTS Advanced Hi-Fill (AHF) technology, ionized PVD deposition techniques will maximize metal coverage in the via, creating an environment for cost-effective via fill fin high aspect ratio architectures.
“We are working closely with SPTS on next-generation 3D-IC developments, and their metal deposition capability forms an integral part of our development process,” said Dr. Laurent Malier, CEO of CEA-Leti. “The unique integration expertise SPTS has in all three areas of deep reactive ion-etching (DRIE), dielectric deposition, and metal seed deposition is invaluable to the success of the work done by this facility and program.”
“SPTS is extremely excited to have been selected as the etch, dielectric and metal deposition partner in CEA-Leti’s 3D-IC development line,” said Kevin T. Crofton, executive vice president, and managing director of the Single Wafer Division at SPTS. “Being one of the early developers of integrated TSV, our team is committed to ensuring the project’s success through our cumulative expertise.”
Commenting on the inauguration of the 3D Integration Line, Susumu Kaminaga, chairman of SPTS and president of Sumitomo Precision Products (SPP) said, “SPTS has been closely associated with TSV research and development with Leti, and we are proud to be a chosen partner for this important milestone.”
SPTS participated at Leti’s Inauguration Day activities in January, and presented on future TSV trends and technical requirements in advanced 3D-IC manufacturing.
About the Sigma® fxPTM PVD System
The award-winning Sigma® fxPTM is a single-wafer cluster tool designed for high-volume PVD processing, offering excellent process control with high throughput. It is a highly flexible system supporting various process chamber configurations and combinations to address a large variety of specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma® fxPTM include, very thick Al alloys for power device and next generation CMOS bondpads, ionized and conventional PVD for 3D-IC and wafer level packaging as well as highly uniform aluminium nitride (AlN) for RF-MEMS devices.
SPP Process Technology Systems was established in October 2009 as the vehicle for the merger of Surface Technology Systems and acquired assets of Aviza Technology. The company is a wholly-owned subsidiary of Sumitomo Precision Products Co., Ltd., and designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. These products are used in a variety of market segments, including R&D, data storage, MEMS and nanotechnology, advanced 3-D packaging, LEDs, and power integrated circuits for communications. For more information on SPTS, please visit www.spts.com
CEA is a French research and technology public organisation, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,500 patent families. For more information, visit www.leti.fr