IWLPC 2017

October 24 - 26 

DoubleTree by Hilton Hotel, San Jose, CA 

Booth #35

IWLPC brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMS device packaging technologies.

SPTS is once again an exhibiting sponsor of IWLPC 2017 and we invite you to visit us at booth #35 to learn more about our wafer processing technologies.

We also invite you to register for the technical conference, and listen to SPTS present:

Rc Management for Next Generation PVD UBM/RDL Metallization Schemes
Tues 24th October; Session 6; 13:30pm.
Presented by Anthony Barker, Product Manager, SPTS.


For more information regarding the conference, click here.

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