IWLPC brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMS device packaging technologies.
SPTS is once again an exhibiting sponsor of IWLPC 2017 and we invite you to visit us at booth #35 to learn more about our wafer processing technologies.
We also invite you to register for the technical conference, and listen to SPTS present:
Rc Management for Next Generation PVD UBM/RDL Metallization Schemes
Tues 24th October; Session 6; 13:30pm.
Presented by Anthony Barker, Product Manager, SPTS.
For more information regarding the conference, click here.