June 25 - 26
Tel Aviv, Israel
Orbotech will be attending and presenting at the SEMI Member Forum, taking place in Tel Aviv on June 25 - 26.
Asher Levy, CEO, Orbotech will be one of the headline speakers at the Forum, presenting on the emerging continuum between Advanced Packaging and PCB-ICS. You can attend his session at 6:30pm on Monday 26th, prior to the Gala Reception.
Orbotech will also be organising guided tours of the Orbotech premises at 8:30am on Monday 26th, for more information regarding the SEMI Member Forum, click here.