April 20 - 21
Pullman Wuxi New Lake
SPTS is presenting on Plasma Dicing at this year's Yole Développement & NCAP Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology.
Richard Barnett, Etch Product Manager for SPTS Technologies will speak at 11:45am on Fri 21st April.
During the 2 days, all aspects including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, Photonics and more will be addressed in one conference, special sessions and key industrial talks.
For more information regarding the Symposium, click here.