Yole Advanced Packaging & System Integration Techology Symposium

 

  April 20 - 21

  Pullman Wuxi New Lake

  Wuxi, China

 

SPTS is presenting on Plasma Dicing at this year's Yole Développement & NCAP Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology.

Richard Barnett, Etch Product Manager for SPTS Technologies will speak at 11:45am on Fri 21st April.

During the 2 days, all aspects including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, Photonics and more will be addressed in one conference, special sessions and key industrial talks.

For more information regarding the Symposium, click here.

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