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On the 15th March 2017, SPTS held their 8th Annual Technical Symposium, in Shanghai. The event included a Keynote Presentation from Dr. Daquan Yu, CTO & President of Research Academy, Huatian Group, entitled "Advanced Wafer Level Packaging Using Via Last TSV and Embedded Silicon Fan-Out (eSiFO) Technology".
It was attended by over 160 customers and invited guests. Here are a few photos of the event.