Plasma Dicing for Next Generation Ultra Small and Ultra Thin Die
Continuing our webinar series on Advanced Packaging applications we are pleased to announce our next webinar on Plasma Dicing on Wednesday 14th September, which we are proud to be co-hosting with Amandine Pizzagalli, Technology & Market Analyst at Yole Développement.
During this webinar, Yole Développement will give its vision and an overview of the key dicing technologies across MEMS devices, power devices, CMOS image sensors, and RFID devices, highlighting its major findings on the evolution and trends of the dicing technologies.
SPTS will be presenting the latest data illustrating how processing routes affect die strength, share experiences with different types of tapes and other die features such as solder balls. We will share details of the latest equipment which is now available for plasma dicing wafers up to 300mm (on 400mm tape frames) for full production applications.
To view this webinar click here