PECVD

Key Benefits

• Wafer sizes from 75mm to 300mm
• Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
• Up to 10 gas lines and optional on-board liquid delivery system
• Mixed frequency plasma capability for stress tuning
• Active platen cooling for critical, low temperature [<175°C] packaging applications

• Single and multi-wafer preheat chamber options for de-gassing sensitive substrates