To address the requirements of both volume manufacturing, pilot production and R&D applications, SPTS offers their etch and deposition process technologies on a range of wafer-handling platform options:
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fxP
An 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity. Available as a 4 – 8” system with vacuum cassettes that are compatible with SMIF robots or as an 8 – 12” system with an integrated EFEM.
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i2L
The i2L is an in-line production system for 3 – 8” wafers, supporting up to 2 process modules for flexibility and control
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LPX
The LPX platform combines a manually-loaded, single wafer vacuum load-lock with SPTS etch or deposition plasma sources to produce a low-cost platform for low volume or R&D applications.
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