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Orbotech’s

Orbotech’s SPTS Technologies Receives Repeat Order for Sigma fxP PVD Systems from Huatian Technology for 300mm Wafer Level Packaging Applications

April 20, 2016
SPTS receives repeat order from Huatian Technology (Kunshan) Electronics Co., Ltd for its Sigma fxP physical vapor deposition (PVD) systems
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Orbotech’s

Orbotech’s SPTS Technologies Receives Repeat Order from JCAP Corporation for Sigma fxP PVD Systems

March 15, 2016
SPTS receives a repeat order for its Sigma fxP 300mm physical vapor deposition (PVD) solutions from JCAP Corporation
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SPTS

SPTS Technologies Wins Top Honours at ESTnet Awards 2016

March 4, 2016
SPTS wins in two categories at the ESTnet Awards, held in Cardiff.
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Orbotech

Orbotech Announces SPTS Technologies has Installed a 300mm MEMS Vapor HF Etch Release Solution at CEA-Leti

December 17, 2015
SPTS has supplied CEA-Leti with its industry-leading vapor HF etch release systems for 300mm MEMS-on-CMOS development.
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Orbotech

Orbotech Receives $57 million in orders from a Leading Semiconductor Manufacturing Company to Support Fan-Out Wafer Level Packaging Production

December 9, 2015
SPTS has received orders totaling approximately $57 million in value for multiple Sigma fxP PVD systems from a global manufacturer of packaged die.
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