NEWS ARCHIVE

NEWSROOM

Orbotech’s

Orbotech’s Emerald™ Laser Via Formation Solution Selected by Huatian for 3D Wafer-Level Packaging Applications

November 28, 2016
Orbotech sells Emerald Laser Via Formation system to Huatian Technology for 3D wafer-level packaging.
Read More
Orbotech’s

Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment

November 2, 2016
SPTS Technologies today announced that it has received an order from NANIUM, S.A. for a 300mm Sigma fxP PVD system to expand NANIUM’S Fan-out Wafer Level Packaging (FOWLP) capacity.
Read More
Orbotech’s

Orbotech’s SPTS Technologies Wins Two 2016 Best Factory Awards and Two Insider Made in Wales Awards

October 27, 2016
SPTS wins four prestigious business awards; Two Best Factory Awards and Two Made in Wales Awards
Read More
Orbotech’s

Orbotech’s SPTS Technologies Collaborates with Novati Technologies to Establish New Plasma Dicing Line

September 7, 2016
SPTS announces its collaboration with Novati Technologies, to establish a new plasma dicing line in Austin, TX.
Read More
Orbotech

Orbotech Inkjet™ 600 Selected by Amkor Technology for System-in-Package Applications

July 11, 2016
Orbotech Inkjet™ 600 system has been selected by Amkor Technology, Inc., to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products.
Read More
Back  |  Top