Leading Assembly and Test Services Provider To Deploy SPTS Etch, PVD and CVD Technologies for Integrated Through Silicon Via (TSV) Process
Newport, United Kingdom — 26 Apr, 2011 — SPP Process Technology Systems (SPTS), a leading manufacturer of plasma etch, deposition, and thermal processing equipment for the micro-device and semiconductor industry today announced, that it had won a multi-system order for its Sigma PVD, Omega Etch and Delta CVD wafer processing systems from a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region. The systems will be used to create through silicon via (TSV) structures for 3D-IC packaging and marks a new penetration for SPTS. This win affirms SPTS’s position as one of the leading solution providers to the packaging market with a customer list that includes many of the top 10 OSAT companies such as STATS ChipPAC (http://www.spts.com/index.asp?m=185&month=6&year=2010&c=1206) and SPIL.
As a pioneer in TSV processing technology, SPTS’s technical expertise in three of the critical process steps, including deep silicon and complementary etches to form the via, physical vapor deposition (PVD) for metal barrier and seed liner, and chemical vapor deposition (CVD) to create the dielectric isolation layer, combine to produce an optimized TSV. This integrated process capability provides an accelerated path to low cost and high yield manufacturing.
“SPTS won this multi-system order through data sharing, on-wafer demonstration and customer references,” said Kevin Crofton, chief operating officer and managing director of the Single Wafer Division. “Our team of engineers was able to enhance and fine-tune our customer’s processes in an integrated manner leading to a positive decision for their 3D-IC line. Pure-play packaging houses rely on our TSV integration knowledge to help accelerate their time to market, with proven return on capital investment (ROI).”
About the Sigma® fxP [TM] PVD System
The award-winning Sigma® fxP [TM] is a single-wafer cluster tool designed for high-volume PVD processing, offering excellent process control with high throughput. It is a highly flexible system supporting various process chamber configurations and combinations to address a large variety of specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma® fxP TM include, very thick Al alloys for power device and next generation CMOS bondpads, ionized and conventional PVD for 3D-IC and wafer level packaging as well as highly uniform aluminium nitride (AlN) for RFMEMS devices.
About Omega Etch Systems
SPTS’ award-winning Omega etch systems are a suite of single-wafer etch process modules designed for a variety of market applications. The market leading Omega™ Deep Reactive Ion Etching (DRIE) process modules provide production-worthy process capability, with very high throughputs and exceptional tilt control for Bosch process silicon etching used in MEMS and 3D-IC/Through-Silicon-Via (TSV) manufacturing. The Omega Inductively Coupled Plasma (ICP) process modules offer a range of compound semiconductor etch processes comprising GaAs, GaN, GaP for LEDs and high frequency RF devices, and Omega APS is focussed on etching dielectric and low volatility materials, relevant to a variety of applications within MEMS, LEDs and TSV markets.
About Delta PECVD Systems
Delta PECVD Systems offer productive, single-wafer processes for the deposition of dielectric films on wafer sizes up to 300mm. The PECVD chamber is supported by all SPTS cluster platforms and also by the unique Versalis fxP hybrid cluster system. A single chamber design supports multiple wafer sizes. Digital control of critical hardware components gives precise and repeatable process performance across a range of applications, with a unique platen design enabling <200°C deposition temperatures. Key Delta applications include; ultra-uniform silicon nitride for GaAs RFIC capacitor, low temperature dielectrics for advanced packaging and tuned-stress films for MEMS.