One of China’s Leading Advanced Packaging Providers Selects SPTS PVD Solution to Expand its 300mm Bumping Capacity
NEWPORT, UK, March 15, 2016 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, received a repeat order for its Sigma fxP 300mm physical vapor deposition (PVD) solutions from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and a leading Chinese advanced packaging house specializing in wafer-level packaging services to global semiconductor companies. The additional Sigma fxP PVD systems will enable JCAP to more than double the capacity of its flip chip packaging line.
“With the rapidly developing semiconductor industry in China, we have seen increasing investment by domestic packaging companies to add capacity in order to keep pace with demand,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “JCAP is a leader in bumping services for wafer-level packaging in China and is gearing up for the extra capacity anticipated to be required to meet the needs of its customer base. Wafer-level packaging is a fast-growing but extremely cost-sensitive activity, so customers appreciate the benefits of our Sigma systems. They are able to achieve more than 30% cost of ownership savings over traditional PVD because of our unique approach to wafer degassing, high-rate pre-clean, and long intervals between maintenance events.”
Mr. CM. Lai, President of JCAP, stated: “JCAP offers a wide range of bumping solutions to both domestic and global customers. In order for us to remain competitive in this highly cost-sensitive market, we need to offer the lowest cost solutions without compromising on quality. SPTS’ 300mm Sigma PVD system and consistently responsive service support team have been key in enabling us to achieve both of these objectives. To grow our business and be a world-class semiconductor packaging company, we need to work with leading equipment suppliers such as SPTS. The flexibility to handle both 200mm and 300mm wafer sizes and different materials - without the need for any major hardware changes - made it an easy decision to add more Sigma fxP PVD systems to expand our capabilities.”
The SPTS 300mm PVD system for bumping applications comprises multi-wafer degas, SE-LTX pre-clean module and PVD modules for depositing Under Bump Metallization (UBM) and Re-Distribution Layer (RDL) layers. SPTS’ multi-wafer degas module degasses up to 75 wafers in parallel, which allows degas of organic passivation layers at low temperatures without compromising system throughput. The Sigma PVD system also carries the SE-LTX pre-clean module, which can process more than 5,000 wafers before scheduled maintenance, thereby delivering a low cost of ownership solution for UBM and RDL applications.
About JCAP (Jiangyin Changdian Advanced Packaging Co., Ltd.)
JCAP, based in Jiangyin, China, is the only factory in the world with a patent to produce copper pillar bumps. JCAP’s major businesses are dedicated to wafer bumping and bump-related back-end services, which includes thin film UBM, electroplated solder, gold bump and ball drop WLCSP. With its majority shareholder being Jiangsu Changdian Electronics Technology Co., Ltd. (JCET), JCAP is a JCET company. For more information, visit www.jcap.cn.
About SPTS Technologies
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and Allentown, Pennsylvania, , the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com.
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SPTS Technologies Ltd
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Tally Kaplan Porat
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