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TAP Times: Plasma Dicing: Benefits and Process Considerations

Plasma dicing has gained acceptance within the semiconductor industry as a viable alternative to conventional singulation methods using saw blades or lasers, with significant adoption across a range of applications.  

The technology is based on deep reactive ion etching (DRIE)—also known as the “Bosch Process”—a dry plasma etch process that has been in production use for over 20 years within the MEMS and 3D Packaging markets. 

To read the full article in TAP Times go to http://www.taptimes.com/ftp/September-2016/#/14

 

Or view the PDF below. 

 

 

 

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