FOWLP Goes Mainstream
Learn why FOWLP is the fastest growing format in the advanced packaging sector and why SPTS is the leading PVD production supplier to this important market. Discover why SPTS’s Sigma fxP PVD system delivers the highest throughput UMB/RDL for FOWLP applications.
- Market Trends and Drivers
- Fan-Out WLP Fills the Gap
- PVD for UBM/RDL Applications
- Technical Challenges
- Multi-wafer Degas Advantages
- SPTS Sigma fxP PVD System for high volume FOWLP Production
This webinar will be of interest to:
- Semiconductor professionals involved in design, fabrication and/or packaging of semiconductor devices
- Semiconductor Production Engineers responsible for optimizing throughput, yield and quality of semiconductor devices
- Semiconductor Design Engineers
- Anyone wanting to learn more about Advanced Packaging trends and Fan-Out WLP.
To access the recording of this webinar, please email firstname.lastname@example.org.