The RVP-300plus vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.

Process Flexibility

  • Runs 200 and 300 mm simultaneously with no hardware changes
  • Compatible with bonded, thin and bowed substrates
  • Modular hardware enables rapid system conversion for specific applications
  • Advanced across-flow chamber design for enhanced process control and reduced defects     

Excellent thermal control from 100 to >1200° Low Cost of Ownership

  • Dual-boat configuration eliminates wafer load/unload time
  • In-situ clean capability reduces CoO by up to 50%
  • Fast temperature ramp/cool option enables up to 30% reduction in process time
  • Factory certified remanufactured systems available

Product Images:

SPTS AVP 300plus


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