YAVNE, Israel, January 13, 2016 − ORBOTECH LTD. (NASDAQ: ORBK) today announced that it has received an order for seven Emerald™ UV Laser Drilling systems from a leading Japanese manufacturer of ceramic-based electronic components and solutions. This customer, which produces a range of components used in applications including mobile phones, home appliances, automotive systems and healthcare devices, will utilize Orbotech’s Emerald systems to drill smaller, high-quality “via” openings in multi-layer ceramic-based IC substrates for next-generation applications.
Orbotech’s Emerald systems were selected for their ability to support mass production of ceramic-based IC substrates while maintaining throughput, accuracy and quality. Ceramic packaging is often used for very small form factor devices and to ensure RF performance support, which require production tools. The small size and the stringent performance requirements of ceramic designs demand a system that is able to drill extremely small via holes consistently and accurately.
“The worldwide demand for smaller and sleeker electronic devices with higher performance capacity continues to increase”commented Yair Alcobi, President, Orbotech Asia East. “Orbotech’s solutions enable manufacturers to develop next-generation electronic devices in smaller form factors, and offer exceedingly high accuracy with very attractive cost of ownership. This customer’s follow-on order for additional Emerald systems validate the effectiveness of this cutting edge solution and affirms our successful collaboration in providing optimal production tools to meet customers’ needs.”
About Emerald Series UV Laser Drilling
Orbotech’s Emerald series UV Laser Drilling solutions simultaneously drill eight areas on a panel through patented Multi-Path Technology. High-power UV laser drilling achieves the best registration accuracy in the market. The Emerald series supports below 20 μm via drilling through ABF, polyimide, ceramic, resin, mold compounds, metal and solder resist substrates with no residue or damage to the bottom of the via, and no undercut.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ: ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics market and adjacent industries. The company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems.
For more information, visit http://www.orbotech.com/.
Cautionary Statement Regarding Forward-Looking Statements
Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control. Many factors could cause the actual results to differ materially from those projected including, without limitation, timing and extent of achieving the anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively integrate and operate SPTS's business, the timing, terms and success of any strategic or other transaction, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and each of its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices, the timing for a verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea, the final outcome and impact of this matter, including its impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2014, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.
Director of Investor Relations
Tally Kaplan Porat
Head of Corporate Marketing