Advanced Packaging Webinar Series (Part II) - Plasma Etch Solutions for Advanced Packaging
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This webinar was originally broadcast on Wed 22nd September 2022. To access the recording, click the link below:
With advanced device packaging technologies helping maintain the industry’s momentum in the pursuit of higher performance, energy efficient electronics in smaller packages, we continue to explore the wafer processing technologies which make this happen.
Following on from the first part of our Advanced Packaging Webinar series, which covered PECVD, this second webinar will give an introduction to the various plasma etch solutions provided by SPTS for applications within the Advanced Packaging space.
From etching and revealing TSVs for 3D stacking through to adapting a dry etch process as a replacement for CMP, these techniques and solutions will be described and discussed.
Presenter: Richard Barnett, Director, Etch Product Management
Richard Barnett is Director, Etch Product Management at SPTS, with over 20 years experience in a number of fields in the semiconductor industry.
In 2007, he joined what was then Aviza Technology, becoming a part of the etch product management team utilising his background in DRIE processing to help achieve a market-leading install base for that technology.
He is responsible for the management of SPTS’ Mosaic plasma dicing product line and has written and presented many papers about this disruptive new approach to die singulation.
Richard graduated from The University of Nottingham in the UK with a Bachelor’s degree in Materials Engineering and Electronics before entering the semiconductor industry. His roles have bridged the various parts of the supply chain including fab process engineering, wafer supply, equipment vendor process engineer and product management.