Reticle Qualification

• High‑performance defect quality control for mask shop
• Critical pattern and particle defect detection for EUV and optical patterned reticles
• Die‑to‑database and die‑to‑die inspection modes
• Handles a wide range of reticle stack materials
• Supports curvilinear and complex OPC structures, including path and multigon designs
• Advanced optics and image‑processing capabilities support defect capture and inspection throughput
• Deep learning AI algorithms for critical defect capture
• Meets stringent cleanliness requirements for mask manufacturing

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• Reticle defect inspection for reticle manufacturing and IC fab quality control
• Inspection of a wide range of optical reticle types, including chrome‑on‑glass, OPC, and phase‑shift reticles at 248nm and 193nm wavelengths
• Detection of classical reticle defects, including intrusions, extrusions and point defects
• Deep ultraviolet (DUV) image acquisition for patterned reticle inspection
• Proven inspection algorithms for reliable defect detection
• Low false defect rates to support manufacturing inspection needs
• High‑speed pattern inspection
• Pre‑ and post‑pellicle pattern inspection in mask shops
• Incoming reticle quality control for IC fabs

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• Accurate and comprehensive characterization of reticle pattern placement error
• Support for reticle development, qualification, and quality control during production monitoring
• Mask writer qualification features, such as Local Registration (beam placement) and Full Mask Scan (stage positioning), generate data to support e‑beam mask writer correction workflows
• Measurement of pattern placement error on targets and on‑device pattern features, with model-based algorithms, such as TrueReg D:DB, enabling massive in-die measurements
• Comprehensive reticle characterization measurement capabilities, such as flatness, centrality and through‑pellicle measurements
• Characterization and reduction of reticle‑related contributions to device overlay error in the IC fab
• Flexible operation with selectable performance and productivity modes and automated recipe generation
• EUV mask blank defect mitigation for accurate positioning of blank defects

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• In situ reticle temperature measurement during reticle manufacturing processes
• Qualification and monitoring of e‑beam mask writers, including long-duration temperature data collection that helps verify thermal stability prior to writing critical reticles
• Monitoring of high‑temperature reticle process steps
• Post‑exposure bake characterization
• Hot plate temperature uniformity monitoring
• Hot plate matching for process consistency
• Identification and reduction of post‑write thermal variations affecting reticle quality

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• Inspection and qualification of EUV and optical reticles throughout production lifecycle
• Incoming reticle quality assessment and periodic re‑qualification during IC fab high-volume manufacturing
• Detection of yield‑critical reticle defects before wafer printing
• Single-die (SD) and multi-die (MD) inspection algorithms enable full coverage and high sensitivity on SD and MD reticles
• Focus tracking and imaging flexibility support robust defect detection
• Hardware technologies and optimized subsystems enable high throughput for support of fast reticle qualification cycle times in high‑volume manufacturing

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• Tunable DUV broadband illumination source provides optimized wavelength ranges for inspection of EUV resist and etch stacks
• Integration of Print Check capability on Gen5 broadband plasma patterned wafer defect inspection systems for capture of yield-critical repeater defects
• Optical and customized algorithmic techniques maximize signal, minimize overall noise and achieve strong signal-to-noise ratio for yield-critical repeater defects
• High sensitivity at optimal cost of ownership enables high frequency sampling for reticle requalification in both foundry and DRAM applications
• Support for high sensitivity reticle re-qualification for both multi-die and single-die reticles
• Complementary to standard reticle inspection for complete reticle quality control at optimized cost

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• Inspection and qualification of optical reticles throughout production lifecycle
• Incoming reticle quality assessment and periodic re‑qualification during IC fab high-volume manufacturing
• Detection of yield‑critical reticle defects before wafer printing, such as haze and other progressive defects
• Requalification of cleaned reticles to ensure pattern integrity
• Incoming reticle qualification to verify reticles meet specifications upon delivery to the IC production fab

Feature availability depends on specific product model. Click the Contact button to obtain more information.

• Mask blank defect inspection for optical and EUV lithography applications
• Laser scattering technology supports high‑sensitivity detection of mask blank defects at high speed for fast time to results
• Automatic defect dispositioning of reticle blank defect types, such as pinholes in photoresist and particles.

Feature availability depends on specific product model. Click the Contact button to obtain more information.