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This webinar was originally broadcast on Wed 10th November 2021.  To access the recording, click the link below:

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Advanced Packaging Webinar Series (Part III) – PVD Processes for UBM/RDL  (Wed 10th Nov)

In the third and final part of our webinar series on the various wafer level processes that are enabling the implementation of a range of different “advanced” packaging solutions, this 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.

With the adoption of organic materials for passivation and substrate materials (e.g. epoxy mold in FO-WLP) the technical challenges for under-bump metal (UBM) and redistribution layer (RDL) deposition are predominantly in the areas of pre-treatment, becoming even more challenging as line/space dimensions reduce to increase I/O density, improve device performance, and reduce form factor. 

This webinar will explain some unique features of SPTS’s Sigma® fxP that offers low and stable contact resistance (Rc), whilst delivering CoO advantages over other PVD systems, with hardware options tailored specifically for BEOL users, where CoO, throughput and yield are critical.

Presenter: Chris Jones, Senior Director, PVD Product Management

Chris Jones is Senior Director for PVD Product Management. He is responsible for the SPTS PVD product line covering all aspects of marketing including product positioning and the provision of support to the worldwide sales team.

After completing his BEng in Mechanical Engineering in 1995 at the University of Bristol, UK, he joined SPTS working in Field Service and then Process Engineering before moving into Product Management in 2004.   Chris has presented widely on SPTS products and is an author of several technical articles.