FOWLP Webinar - Oct 2015

Did you miss this webinar?

This Webinar was originally broadcasted on the 13th October 2015. To access the recording, click the link below. 

Please fill out your details to get access to the Webinar

Please provide your name
Please provide your name
Please provide your email address
Please provide your company name
Please provide your job title
Please confirm that you have read and agree to the privacy policy

Privacy Policy

×

FOWLP Goes Mainstream

Learn why FOWLP is the fastest growing format in the advanced packaging sector and why SPTS is the leading PVD production supplier to this important market. Discover why SPTS’s Sigma fxP PVD system delivers the highest throughput UMB/RDL for FOWLP applications.

Topics covered:

  • Market Trends and Drivers
  • Fan-Out WLP Fills the Gap
  • PVD for UBM/RDL Applications
  • Technical Challenges
  • Multi-wafer Degas Advantages
  • SPTS Sigma fxP PVD System for high volume FOWLP Production

 
This webinar will be of interest to:

  • Semiconductor professionals involved in design, fabrication and/or packaging of semiconductor devices
  • Semiconductor Production Engineers responsible for optimizing throughput, yield and quality of semiconductor devices
  • Semiconductor Design Engineers
  • Anyone wanting to learn more about Advanced Packaging trends and Fan-Out WLP.

To access the recording of this webinar, please click here