Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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Spotlight on KLA Korea: Focus on Customers and Community
Our virtual tour of KLA’s global locations continues with a spotlight on KLA Korea. Operating in South Korea since...
KLA Ann Arbor Hackathon Tackles Digital Transformation
Keeping with KLA’s vision of turning ideas into possibilities by creating transformative solutions, 75 employees in Ann Arbor, Michigan brainstormed...
KLA Announces Third Quarter Earnings
The video below highlights KLA’s key financial information from the earnings report for the third quarter. To read the...
New Orbotech Corus™ Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus™ 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech...
Multidisciplinary: Engineer’s Journey from Apprentice to Leader
We caught up with Matt Hill, manufacturing manager, Allentown, Pennsylvania, who shares some thoughts with people seeking to explore...
KLA Location Spotlight: Yavne, Israel
We return to Israel on our virtual tour of our global locations. This time to Yavne, situated just south...
Interns Talk About their Experiences in KLA’s Culture of Learning
University students gained valuable on-the-job training and experience across multiple functions during summer 2022 internships at KLA’s global locations....
Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
Today’s chip manufacturers contend with strict requirements when it comes to quality assurance, since more complex chips are powering...
Trending: KLA’s ‘Future of Advanced Packaging’ Video
In the last few years, the role of semiconductor packaging has been evolving into a key enabler of the...