Photolithography: What IC Substrate Manufacturers Need to Know
Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a...
KLA Singapore Announces Site Expansion, Supporting Customers and Opening Local Career Paths
As one of the company’s fastest-growing operations, KLA Singapore has completed the first phase of a new facility, building its...
KLA Supports Growth of Local Semiconductor Industry at Debut SEMICON India 2024
As India continues to establish itself as a rising player in the global chipmaking ecosystem, KLA India is demonstrating its...
KLA Advances Semiconductor Packaging and More at SEMICON Taiwan
Innovation is diversifying in the semiconductor chip industry, resulting in new approaches to meet the performance needs of advanced technologies...
Q&A: KLA’s Oreste Donzella Discusses how Semiconductor Innovation Thrives in Advanced Packaging
We sat down with Oreste Donzella, who explains how innovation is diversifying in the semiconductor chip industry, resulting in new...
Connecting, Collaborating and Innovating at SEMICON West 2024
The semiconductor industry came together again in July for SEMICON West 2024, which focused on critical areas of the U.S....
BBP: 40 Years of Discovery at the Speed of Light™
For 40 years our broadband plasma (BBP) patterned wafer inspectors have been at the forefront of defect discovery for the...
Celebrating 40 Years of Broadband Plasma (BBP): A Milestone in Semiconductor Manufacturing
Broadband Plasma (BBP) – A Vital Role in Semiconductor Quality Assurance Forty years ago, KLA introduced the KLA 2020, the...
KLA’s Legacy of Broadband Plasma Products Lights the Way for Future Innovations
In today’s digital world, the extensive use of electronic devices and accelerating use of AI drive demand for a diverse...
SPIE 2024: Our Engagements Drive Ideas that Move Us Forward
The semiconductor industry is poised for extraordinary growth in the years to come, and innovation is at the core of...
IC Substrates, Part II: Six Yield-Critical Challenges for Manufacturers
Part II of this series on integrated circuit (IC) substrates focuses on six yield-critical challenges ICS manufacturers should tackle to...
A Fine Future: IC Substrates Essentials, Part I
The electronics industry’s quest for higher performance and greater speed continues to intensify, driving growing complexity in front end semiconductor...