SPTS Technologies are pleased to be exhibiting at the 15th International Conference and Exhibition on Device Packaging, 4 - 7 March 2019 at the WekoPa Resort and Casino, Fountain Hills.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields, and we invite you to visit us at booth #32 to learn more about our wafer processing technologies and solutions.
Stewart Fulton will be presenting 'Dicing Tape Performance in a Plasma Dicing Environment' at 11:15 am on Thursday 7th March at the 3D Applications and Technologies Forum.
To learn more about the iMAPS conference please click here