SPTS's c2L Wafer Handling Platform
The c2L is an cost-effective cluster platform for low volume or pilot production. It supports up to 3 process modules for flexibility and control, and is compatible system for 3 – 8” wafers. Using industry standard robotics and VCE cassette, the c2L is also available with SMIF as an option.
The c2L platform is compatible with all SPTS's process modules, including Monarch 25 and Monarch 300 HF etch modules, and CVE XeF2 etch modules.
- Omega® c2L - a cluster system supporting up to 3 plasma etch (ICP, DRIE, and/or Synapse) chambers
- MosaicTM c2L - a cluster system supporting up to 3 plasma dicing chambers
- Primaxx® c2L - a cluster system supporting up to 3 Monarch 25 vapor HF etch chambers
- Xactix® c2L - a cluster system supporting up to 3 CVE XeF2 etch chambers
- Sigma® c2L - a cluster system supporting up to 3 PVD chambers (including associated pre-clean/degas module options)
- DeltaTM c2L - a cluster system supporting up to 3 PECVD chambers
- VersalisTM c2L - a cluster system supporting a mixture of etch and deposition process chambers (up to 3 modules in total), useful for R&D or pilot production, saving both capital expenditure and cleanroom footprint.