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  • Virtual

SPTS will again sponsor ECTC in its 17th year, taking place virtually from 1st June through to July 4th. 

As well registration patrons, we are proudly sponsoring Session 16: Innovation on Bonding and Hybrid Bonding Materials and Processing

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

For more information on the event click here.


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