Webinars
15th December 2021
Filtering for 5G (Update 2021) – AlScN and electrode metal deposition for Advanced BAW filters
In this webinar we present the latest PVD technology solutions to deposit very thin highly doped layers of AlN, and the associated electrode metals. We discuss how to control the critical aspects of doped AlN deposition such as the control of mis-orientated grains and most importantly the control of the stress state of the piezo layer.
For more information, click here
10th November 2021
Advanced Packaging Webinar Series (Part III) - PVD Processes for UBM/RDL
In the third and final part of our webinar series on the various wafer level processes that are enabling the implementation of a range of different “advanced” packaging solutions, this 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.
For more information, click here
22 September 2021
Advanced Packaging Webinar Series (Part II) - Plasma Etch Solutions for Advanced Packaging
This webinar will give an introduction to the various plasma etch solutions provided by SPTS for applications within the Advanced Packaging space. From etching and revealing TSVs for 3D stacking, through to adapting the dry etch as a replacement for CMP, these techniques and solutions will be described and discussed.
For more information, click here
25 August 2021
Advanced Packaging Webinar Series (Part I) - Low Temperature Dielectric Deposition for Advanced Packaging
In this webinar we demonstrate how high quality PECVD dielectric films can be deposited at temperatures as low as 100°C while maintaining high film quality and stability. We then discuss the use of these films in a number of advanced packaging applications.
For more information, click here
30 June 2021
Shining a Light on Etch and Deposition for Photonic Device Manufacturing
In this webinar we discuss the etch and deposition process requirements and challenges to create photonic devices on a range of substrate types including silicon and compound semiconductors and showcase the breadth of our experience gained over the past 20 years, working with a broad range of photonic device developers and manufacturers.
For more information, click here
5 May 2021
Plasma Dicing V - What's New for 2021?
This webinar gives an overview of the latest plasma dicing developments from SPTS including the launch of the Mosaic OHT platform, a follow-up on the management of fluorine left behind by the Si dicing etch as well as a general update on market and process trends.
For more information, click here
2 Dec 2020
Get Switched On to PVD for SiC Power
In this webinar you'll learn how Sigma® fxP PVD overcomes various metallization challenges which can affect yields in SiC power device manufacturing, including eliminating whiskers, optimizing film thickness uniformity and repeatability of Ni films for silicide formation, avoiding contamination, active-face protection and stress control.
For more information, click here
21 Oct 2020
Addressing the PVD Challenges in High Density FO-WLP
Learn how FO-WLP is evolving and why SPTS is the leading PVD production supplier to this important market. We will explain how SPTS’s Sigma® fxP PVD system has all the necessary features that high volume manufacturers require for these emerging HD FO applications, such as specialized pre-treatment technology designed to manage contamination, maintain low and stable Rc, while delivering high uptime, throughput and yields.
For more information, click here
17 June 2020
PECVD Dielectric Films for RF & Power Compound Semiconductor Applications
In this webinar, we will discuss PECVD process and hardware optimization for the production of SiN films with the productivity required for high volume manufacturing of power and RF devices. We’ll show how processes can be tuned to run at low plasma densities to minimise surface damage to sensitive GaN devices and discuss bow compensation strategies to minimize bow and warp on thinner substrates.
For more information, click here
20th May 2020
Filtering for 5G - AlScN deposition for the next generation of BAW filters
In this webinar we present the latest PVD technology solutions to deposit very thin highly doped layers of AlN. We discuss how to control the critical aspects of doped AlN deposition, like the layer thickness uniformity, the crystallographic texture of the film, the control of mis-orientated grains and most importantly the control of the stress state of the film within the wafer. We demonstrate outstanding within wafer stress performance and mis-orientated grain control for AlN layers with atomic Sc content up to 30%.
For more information, click here
29th April 2020
Power Crazy! Critical Plasma Etching Applications to Meet the Demands for Wide Bandgap Devices
This webinar will review specific etch needs and show examples of high productivity solutions for manufacturing SiC and GaN-based power devices. These will include hard-mask open and shallow SiC trench etching, deep SiC via formation for RF and low damage SiNx and GaN etching primarily for GaN on Si structures. End-point detection, an essential method of process control, will also be discussed.
For more information, click here
24th March 2020
Plasma Dicing IV - The Next Chapter
As the adoption of plasma dicing continues to build momentum, the barriers to adoption continue to be broken down.
This webinar will highlight some of our recent work in these areas. There will be examples of how SPTS, and our partners, have managed the necessary use of fluorinated chemistries and mitigated the potential risks for subsequent steps. Further development of the LASER groove will also be covered, underlining the importance of achieving a successful process integration with the DRIE step.
Finally, we also introduce our latest tranche of work utilizing our plasma dicing experience for GaAs substrates
For more information, click here
30th Oct 2019
Challenges in Dry Etching of AlN & AlScN for BAW Filters
Piezoelectric thin films are commonly used as the resonator in bulk acoustic wave (BAW) devices for RF filtering in handsets. AlN is the base piezoelectric material but recent trends involve doping heavily with scandium (Sc) to improve the coupling efficiency. Device makers are currently working with Sc content in the range 6-30at%. As feature sizes have reduced over time the industry has also moved from wet etching to dry etching to define the piezoelectric layer and the associated metal electrodes. Unfortunately, increasing the Sc makes dry etching more problematic because of the low volatility of scandium halides relative to those of Al and N.
This Webinar focuses on these dry etch challenges and presents solutions based on the use of a high density plasma etch module called Synapse. Etch data will include performance comparisons with more mainstream ICP type reactors.
For more information, click here
31st July 2019
End-Point Detection for Plasma Etching - Knowing when to stop!
Plasma etching is a critical step in the fabrication of all semiconductor based devices including Memory, Logic, RF, Power, MEMS and Optoelectronics chip-sets.Time based etching is prone to unplanned variations in layer thicknesses, layer composition and/or etch rate variations caused by Etch chamber conditioning. End-point detection is key to controlling Plasma Etches because it precisely defines the point at which the etching must stop. This eliminates the risks of under-etching (which would require wafer re-work) or over-etching, which can easily lead to excessive CD loss, sidewall pitting, stop layer loss and throughput deficiencies.
For more information, click here.
6th March 2019
Ramping up the Power – 300mm PVD for Metallization of Silicon IGBTs and other Power Semiconductor Devices
This webinar discusses how physical vapor deposition (PVD) can be used to deposit both thick frontside metal, and thinner multi-layer backside metals deposited after wafer thinning. The presentation will give details of how SPTS Sigma® PVD technology overcomes various challenges which can affect yields in power device manufacturing, including eliminating whiskers during thick metal deposition, avoiding contamination from organics, active-face protection and stress control of backside layers on thinned wafers.
For more information, click here.
19th June 2018
Advances in doped AlN deposition techniques for next generation PiezoMEMS
In this webinar we present a novel solution providing symmetrical control and adjustment of stress for AlN films with different Sc content. We demonstrate excellent WIW stress performance, the ability to locally tune stress to compensate for centre to edge variations in Sc, and approaches to prevent formation of crystallite defects, maximizing yield.
For full information, click here.
21st March 2018
Solving the Plasma Dicing Puzzle
This webinar will discuss the integration of plasma dicing into volume production, including cost implications, the influence of tape selection, and end-point options for process control in volume production. Of topical note is the combination of LASER and plasma for quicker avenues to adoption and this session will cover how the plasma etch can accommodate the side effects of LASER grooving, showing examples of this approach and the benefits that can be achieved.
For more information, click here.