15th December 2021

Filtering for 5G (Update 2021) – AlScN and electrode metal deposition for Advanced BAW filters

In this webinar we present the latest PVD technology solutions to deposit very thin highly doped layers of AlN, and the associated electrode metals.  We discuss how to control the critical aspects of doped AlN deposition such as the control of mis-orientated grains and most importantly the control of the stress state of the piezo layer.  

For more information, click here

10th November 2021

Advanced Packaging Webinar Series (Part III) - PVD Processes for UBM/RDL

In the third and final part of our webinar series on the various wafer level processes that are enabling the implementation of a range of different “advanced” packaging solutions, this 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.

For more information, click here


22 September 2021

Advanced Packaging Webinar Series (Part II) - Plasma Etch Solutions for Advanced Packaging 

This webinar will give an introduction to the various plasma etch solutions provided by SPTS for applications within the Advanced Packaging space. From etching and revealing TSVs for 3D stacking, through to adapting the dry etch as a replacement for CMP, these techniques and solutions will be described and discussed.

For more information, click here

25 August 2021

Advanced Packaging Webinar Series (Part I) - Low Temperature Dielectric Deposition for Advanced Packaging

In this webinar we demonstrate how high quality PECVD dielectric films can be deposited at temperatures as low as 100°C while maintaining high film quality and stability. We then discuss the use of these films in a number of advanced packaging applications.

For more information, click here

30 June 2021

Shining a Light on Etch and Deposition for Photonic Device Manufacturing

In this webinar we discuss the etch and deposition process requirements and challenges to create photonic devices on a range of substrate types including silicon and compound semiconductors and showcase the breadth of our experience gained over the past 20 years, working with a broad range of photonic device developers and manufacturers.

For more information, click here

5 May 2021

Plasma Dicing V - What's New for 2021?

This webinar gives an overview of the latest plasma dicing developments from SPTS including the launch of the Mosaic OHT platform, a follow-up on the management of fluorine left behind by the Si dicing etch as well as a general update on market and process trends.

For more information, click here

2 Dec 2020

Get Switched On to PVD for SiC Power

In this webinar you'll learn how Sigma® fxP PVD overcomes various metallization challenges which can affect yields in SiC power device manufacturing, including eliminating whiskers, optimizing film thickness uniformity and repeatability of Ni films for silicide formation, avoiding contamination, active-face protection and stress control.

For more information, click here

21 Oct 2020

Addressing the PVD Challenges in High Density FO-WLP

Learn how FO-WLP is evolving and why SPTS is the leading PVD production supplier to this important market. We will explain how SPTS’s Sigma® fxP PVD system has all the necessary features that high volume manufacturers require for these emerging HD FO applications, such as specialized pre-treatment technology designed to manage contamination, maintain low and stable Rc, while delivering high uptime, throughput and yields.

For more information, click here

17 June 2020

PECVD Dielectric Films for RF & Power Compound Semiconductor Applications

In this webinar, we will discuss PECVD process and hardware optimization for the production of SiN films with the productivity required for high volume manufacturing of power and RF devices. We’ll show how processes can be tuned to run at low plasma densities to minimise surface damage to sensitive GaN devices and discuss bow compensation strategies to minimize bow and warp on thinner substrates.

For more information, click here

20th May 2020

Filtering for 5G - AlScN deposition for the next generation of BAW filters

In this webinar we present the latest PVD technology solutions to deposit very thin highly doped layers of AlN.  We discuss how to control the critical aspects of doped AlN deposition, like the layer thickness uniformity, the crystallographic texture of the film, the control of mis-orientated grains and most importantly the control of the stress state of the film within the wafer.  We demonstrate outstanding within wafer stress performance and mis-orientated grain control for AlN layers with atomic Sc content up to 30%.

For more information, click here

29th April 2020

Power Crazy! Critical Plasma Etching Applications to Meet the Demands for Wide Bandgap Devices

This webinar will review specific etch needs and show examples of high productivity solutions for manufacturing SiC and GaN-based power devices. These will include hard-mask open and shallow SiC trench etching, deep SiC via formation for RF and low damage SiNx and GaN etching primarily for GaN on Si structures. End-point detection, an essential method of process control, will also be discussed.

For more information, click here

24th March 2020

Plasma Dicing IV - The Next Chapter

As the adoption of plasma dicing continues to build momentum, the barriers to adoption continue to be broken down. 

This webinar will highlight some of our recent work in these areas.  There will be examples of how SPTS, and our partners, have managed the necessary use of fluorinated chemistries and mitigated the potential risks for subsequent steps. Further development of the LASER groove will also be covered, underlining the importance of achieving a successful process integration with the DRIE step. 

Finally, we also introduce our latest tranche of work utilizing our plasma dicing experience for GaAs substrates

For more information, click here

30th Oct 2019

Challenges in Dry Etching of AlN & AlScN for BAW Filters

Piezoelectric thin films are commonly used as the resonator in bulk acoustic wave (BAW) devices for RF filtering in handsets.  AlN is the base piezoelectric material but recent trends involve doping heavily with scandium (Sc) to improve the coupling efficiency.  Device makers are currently working with Sc content in the range 6-30at%.  As feature sizes have reduced over time the industry has also moved from wet etching to dry etching to define the piezoelectric layer and the associated metal electrodes.  Unfortunately, increasing the Sc makes dry etching more problematic because of the low volatility of scandium halides relative to those of Al and N.

This Webinar focuses on these dry etch challenges and presents solutions based on the use of a high density plasma etch module called Synapse.  Etch data will include performance comparisons with more mainstream ICP type reactors.

For more information, click here

31st July 2019

End-Point Detection for Plasma Etching - Knowing when to stop!

Plasma etching is a critical step in the fabrication of all semiconductor based devices including Memory, Logic, RF, Power, MEMS and Optoelectronics chip-sets.Time based etching is prone to unplanned variations in layer thicknesses, layer composition and/or etch rate variations caused by Etch chamber conditioning. End-point detection is key to controlling Plasma Etches because it precisely defines the point at which the etching must stop.  This eliminates the risks of under-etching (which would require wafer re-work) or over-etching, which can easily lead to excessive CD loss, sidewall pitting, stop layer loss and throughput deficiencies.

For more information, click here.

6th March 2019

Ramping up the Power – 300mm PVD for Metallization of Silicon IGBTs and other Power Semiconductor Devices

This webinar discusses how physical vapor deposition (PVD) can be used to deposit both thick frontside metal, and thinner multi-layer backside metals deposited after wafer thinning.  The presentation will give details of how SPTS Sigma® PVD technology overcomes various challenges which can affect yields in power device manufacturing, including eliminating whiskers during thick metal deposition, avoiding contamination from organics, active-face protection and stress control of backside layers on thinned wafers. 

For more information, click here.

19th June 2018

Advances in doped AlN deposition techniques for next generation PiezoMEMS

In this webinar we present a novel solution providing symmetrical control and adjustment of stress for AlN films with different Sc content.  We demonstrate excellent WIW stress performance, the ability to locally tune stress to compensate for centre to edge variations in Sc, and approaches to prevent formation of crystallite defects, maximizing yield.

For full information, click here.

21st March 2018

Solving the Plasma Dicing Puzzle

This webinar will discuss the integration of plasma dicing into volume production, including cost implications, the influence of tape selection, and end-point options for process control in volume production. Of topical note is the combination of LASER and plasma for quicker avenues to adoption and this session will cover how the plasma etch can accommodate the side effects of LASER grooving, showing examples of this approach and the benefits that can be achieved.

For more information, click here.

22nd Feb 2018


This seminar will introduce specialized  coatings for manufacturing MEMS and related devices.  This will include hydrophobic and anti-stiction coatings, and very thin, transparent films for moisture barriers and corrosion avoidance.

For more information click here.

28th September 2017

Bumps with better contact; Latest Advances in PVD UBM/RDL Metallization

This webinar discusses in detail the mechanisms behind Rc increase, with a focus on degas and pre-clean stages of the UBM/RDL process flow.  A comparison of techniques used in production today to manage the issue will be presented.  Finally, a novel approach to produce low and stable Rc performance in volume production for current and next generation device packaging schemes will be introduced.

For more information click here.

30th August 2017

Powering on with High Productivity SiC and GaN Etch

This webinar focuses on SPTS’s approach to SiC etching, based on the unique Synapse™ process module with a plasma density that is ten times higher than standard ICP reactors. We will give examples of deep SiC back-side via etching for GaN devices as well as shallower trench structures on the front-side of SiC wafers. Our focus will be on high productivity process solutions consistent with the increasing demand for volume production of these device types.

For more information click here.

15th December 2016

AlN for Next Generation PiezoMEMS

Designers are starting to use Aluminum Nitride (AlN) and other piezo materials by physical vapor deposition (PVD) for a new range of high performance MEMS devices such as microphones, finger print sensors, energy harvesters, speakers and Si oscillators. This webinar examines how the success of deposition of AlN by PVD for the established RF BAW market has provided a roadmap to develop these new MEMS based applications. You will hear how new material requirements and film properties are being met with SPTS’s latest Sigma fxP PVD hardware and technologies.

For more information, click here.

14th September 2016

Plasma Dicing for Next Generation Ultra Small and Ultra Thin Die

Continuing our webinar series on Advanced Packaging applications we are pleased to have presented our webinar on Plasma Dicing on Wed 14th Sept 2016, which was co-hosting with Amandine Pizzagalli, Technology & Market Analyst at Yole Développement.

During the webinar, Yole Développement will gave its vision and an overview of the key dicing technologies across MEMS devices, power devices, CMOS image sensors, and RFID devices, highlighting its major findings on the evolution and trends of the dicing technologies.

SPTS presented the latest data illustrating how processing routes affect die strength, share experiences with different types of tapes and other die features such as solder balls. We shared details of the latest equipment which is now available for plasma dicing wafers up to 300mm (on 400mm tape frames) for full production applications.

For more information, click here.

13th October 2015

FOWLP Goes Mainstream

Fan-Out Wafer Level Packaging (FOWLP) is the fastest growing format in the advanced packaging sector.  In Oct 2015, Yole revised its projections to show a 32% CAGR through 2020 as TSMC enters the fray with its InFO product. InFO is just one of a number of different FOWLP formats that are being proposed to meet the industry goals of high density performance at low cost.

All the FOWLP formats embed die in an epoxy mold compound (EMC), and build dense I/O connections outside the periphery of the die, hence the name “Fan-Out”.  The use of EMC presents significant challenges to the makers of RDL and UBM deposition equipment.

During this webinar, hear why FOWLP is receiving such attention, and learn how SPTS deals with the challenges of depositing UBM/RDL metal on EMC substrates and explain why SPTS is the leading PVD supplier to this important market. 

For more information, click here.

13th May 2015

Plasma Dicing - Integrating for Production 

The key to successful introduction of plasma dicing is how to integrate this front-end technology into the back-end process flow. This webinar shows how various schemes can be used to allow plasma dicing to enter the process flow as seamlessly as possible, whilst also introducing SPTS’s Mosaic production plasma dicing system and its range of capabilities.

For more information, click here.