"Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration" Anne Jourdain et al
First Published in Lab on a Chip (Royal Society of Chemistry), 2020,20, pp2788-2795
First published in IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol 10, Iss 4, pp.694-703 (April 2020)
(Journal of Microelectromechanical Systems. Volume: 28 , Issue: 3 , pp432-440, June 2019 )
(iMAPS MINAPAD 2017)
(CS Mantech 2015)
(IEEE Sensors, Vol 15 No 3, pp1849-1857, Mar2015)
(SMTA Pan Pacific Symposium Conference 2014)
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