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(ECTC2020)
"Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery" Chris Bolton et al.
First Published in Lab on a Chip (Royal Society of Chemistry), 2020,20, pp2788-2795
"A study of Integrated Circuit Dicing Tape when used in a Plasma Dicing Environment" H. Fulton et al
First published in IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol 10, Iss 4, pp.694-703 (April 2020)
DOI: 10.1109/TCPMT.2020.2966724
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"MOCVD Copper Metallization for High Aspect Ratios TSV 3D Integration" S. Fadloun
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http://imapsource.org/doi/10.4071/2380-4505-2018.1.000718
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(iMAPS MINAPAD 2017)
"Plasma Dicing 300mm Framed Wafers - Analysis of Improvement in Die Strength and Cost Benefits for for Thin Die Singulation" M. Blair
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"Singulation by Plasma Etching. Integration Techniques to Enable Low Damage, High Productivity Dicing" R. Barnett et al
(ASME InterPACK2015)
"Wafer-to-Wafer Metal Sputter Deposition Process Control by Automatic Deposition Rate Adjustment" C. Weng et al
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"Productivity Challenges in PVD Processing in 300mm Pilot Lines for Power Semiconductors" A Rastogi et al.
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"Development of an Optically Transparent Silicon Based Technology Platform for Biological Analysis" N Davies et al
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"Extending Capabilities of Etch and Deposition Technologies for 3D Packaging of MEMS in Volume Production" C Short et al
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"Advances in Etch and Deposition Technologies for 2.5 and 3D BEOL Processing" K Buchanan et al
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"Claritas™ – A unique and robust endpoint technology for silicon DRIE processes with open area down to 0.05%" O. Ansell et al
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