Intro to HF Release Etch
HF etching is a dry vapor (plasma-less) etch process to remove sacrificial oxide layers, primarily used to release silicon MEMS structures.Download
Dry, vapor phase etch utlizing anhydrous HF of XeF2 is used for the isotropic etching of sacrificial silicon or oxide layers with high selectivity and without stiction. These technologies provide controlled, residue-free etching across a wide range of etch rates.
Key applications for vapor release technology include micromirror arrays and other optical MEMS devices, waveguides, and µLEDs.
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