Plasma Processes for Compound Semiconductors
Overview of the plasma processing technologies which SPTS offers for a variety of Compound Semiconductor applications such as RF, Power and Opto-electronic device manufacturing.
DownloadIII-V device fabrication requires a range of processes including pre-etching of substrates, etching of nitrides, polyimide, BCB and the epitaxial layers on the wafer front-side, along with via etches from the wafer back-side.
These etch processes are available on either the ICP or Synapse™ process modules.
Overview of the plasma processing technologies which SPTS offers for a variety of Compound Semiconductor applications such as RF, Power and Opto-electronic device manufacturing.
DownloadSiC is a wide bandgap material used in power applications and GaN-on-SiC RF devices. It is very difficult to etch but SPTS' Synapse etch system can provide etch rates 2-4x faster than conventional ICP etching.
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