PVD for Photonics and Optoelectonics

SPTS offers PVD processes depositing metals on compound semiconductor substrates for VCSELs, LEDs and other optoelectronic devices, along with 300 mm Si for Integrated Photonics Advanced Packaging.  Applications include diffusion barriers, Au interconnect, stress compensation layers and Si UBM/RDL.

Key Benefits

  • Single wafer processing for improved yield
  • Reliable handling of fragile compound semiconductor substrates
  • ESC compatible with sapphire carriers without the need for a back-coat

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