SPTS in the media

IFTLE 480 : Wafer Thinning and Nano TSVs; Making Money on the Leading Edge

In the last few years, Ann Jourdain of IMEC and co-workers have described silicon device stacking through extreme silicon thinning technology. Recently Jourdan and Dave Thomas of SPTS reviewed this technology for the Jan/Feb issue of Chip Scale Review. The technology is interesting enough that IFTLE will take a closer look at it.

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IFTLE 480 : Wafer Thinning and Nano TSVs; Making Money on the Leading Edge

SPTS in the media

VIEWPOINT 2021: David Butler, EVP and General Manager, SPTS Technologies

We expect 2021 to be a growth year, with contributions from all our main markets. The automotive industry has recovered very quickly with only a modest amount of inventory in the channels. Interestingly, since COVID, people would rather own a car than travel on public transport. A vibrant automotive market supports many parts of the semiconductor industry; power management, connectivity, image sensors, LEDs.

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VIEWPOINT 2021: David Butler, EVP and General Manager, SPTS Technologies

SPTS in the media

200mm Demand Surges

The outlook for SPTS’ 200mm wafer processing equipment is very strong, as it has been for the past 5 years or so,” said David Butler, executive vice president and general manager for SPTS Technologies, a KLA Company. “The buoyancy of the smaller wafer market is very visible in our own stats. As a percentage of our total business, sales for 200mm or smaller declined from 2010 to 2015 when it approached an approximate 50/50 split with 300mm. Then the trend reversed, and the 200mm or smaller percentage is back to 2010 levels.

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200mm Demand Surges