SPTS in the media
IFTLE 459: imec Develops Nano-TSV for Heterogeneous Integration
IMEC worked with SPTS to develop scallop-less nano-TSVs. Functional electrical structures were measured and characterized, showing up to 99% electrical yielding connections between the front side and backside of the device wafers, and confirming a final backside-to-frontside overlay below 15nm.