In the last few years, Ann Jourdain of IMEC and co-workers have described silicon device stacking through extreme silicon thinning technology. Recently Jourdan and Dave Thomas of SPTS reviewed this technology for the Jan/Feb issue of Chip Scale Review. The technology is interesting enough that IFTLE will take a closer look at it.
We expect 2021 to be a growth year, with contributions from all our main markets. The automotive industry has recovered very quickly with only a modest amount of inventory in the channels. Interestingly, since COVID, people would rather own a car than travel on public transport. A vibrant automotive market supports many parts of the semiconductor industry; power management, connectivity, image sensors, LEDs.
The outlook for SPTS’ 200mm wafer processing equipment is very strong, as it has been for the past 5 years or so,” said David Butler, executive vice president and general manager for SPTS Technologies, a KLA Company. “The buoyancy of the smaller wafer market is very visible in our own stats. As a percentage of our total business, sales for 200mm or smaller declined from 2010 to 2015 when it approached an approximate 50/50 split with 300mm. Then the trend reversed, and the 200mm or smaller percentage is back to 2010 levels.
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