IMEC worked with SPTS to develop scallop-less nano-TSVs. Functional electrical structures were measured and characterized, showing up to 99% electrical yielding connections between the front side and backside of the device wafers, and confirming a final backside-to-frontside overlay below 15nm.
KLA’s Oreste Donzella gives Francoise Von Trapp of 3DInCites an update on the recent formation of the company’s Electronics, Packaging and Components (EPC) Group. Read what Oreste had to say about the EPC Group, SPTS Technologies and growth opportunities.
Mark Christoffersen, Director of Manufacturing & Facilities, believes tests might give the business more confidence and bring more people back into work. "From a confidence point of view it would be really beneficial. Obviously the science has to support that, it has to be accurate. For us as a business that would be really important."
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