RVP-300plus
Flexible platform for diffusion, oxidation and LPCVD processes
The RVP-300plus vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.
Process Flexibility
- Runs 200 and 300 mm simultaneously with no hardware changes
- Compatible with bonded, thin and bowed substrates
- Modular hardware enables rapid system conversion for specific applications
- Advanced across-flow chamber design for enhanced process control and reduced defects
Excellent thermal control from 100 to >1200° Low Cost of Ownership
- Dual-boat configuration eliminates wafer load/unload time
- In-situ clean capability reduces CoO by up to 50%
- Fast temperature ramp/cool option enables up to 30% reduction in process time
- Factory certified remanufactured systems available