i-Micronews: Fan-Out Wafer Level Packaging platform discussed with SPTS Technologies 

April 29, 2015

Yole Developpement had the opportunity to interview David Butler, EVP of SPTS. David has shared his point of view on Fan-Out Wafer Level Packaging platform with us...

Full Interview: http://www.i-micronews.com/advanced-packaging-news/5440-fan-out-wafer-level-packaging-platform-discussed-with-spts-technologies.html

"In the last 12 months, FOWLP has emerged from a relatively small btopics in the packaging world. It started with eWLB, the Infineon designed platform that was licensed to a few companies at the end of the last decade, notably STATS ChipPAC and NANIUM. Those two companies now lead the FOWLP market"ase to become one of the most active 

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