The CVE module is compatible with SPTS' cluster platforms, and has a unique chamber design which provides high etch rates, uniformity and efficiency. It is designed allow high vplume production and the integration of  XeF2 modules with the other process modules available from SPTS.

Key Benefits

  • Patented chamber design optimized for gas phase etching
  • Edge lift to protect delicate double sided wafers
  • Temperature controlled chuck with optional backside helium for improved etch rates, uniformity and selectivity
  • Easy conversion between 150 mm and 200 mm wafers
  • Ability to clamp a wide variety of substrate thicknesses
  • Wide range of wafer handling options
  • Transfer under vacuum from a wide variety of SPTS modules

Inquiry about: Xactix® CVE

Please provide your name
Please provide your name
Please provide your email address
Please provide your telephone number
Please provide your job title
Please provide your company name
Please enter your message
Please confirm that you have read and agree to the privacy policy

Privacy Policy