ECTC is the premier international event that brings together the best in packaging, components and microelectronics systems sciences, technology and education in an environment of cooperation and technical exchange. Due to the COVID-19 situation, ECTC 2020 will be held as a virtual event running 3rd to 30th June 2020.
SPTS is proud to be the Session Sponsor for Session 2 on Innovation on WLCSP and 3D Packaging. In this session you can listen to the presentation by Anne Jourdain from imec titled “Extreme Wafer Thinning and Nano-TSV Processing for 3D Heterogeneous Integration”
The virtual conference is now open and will be available 24/7 (on demand) until 5pm EDT (US) / 10.00pm BST (UK) on June 30th.
ECTC Virtual Conference is a FREE event - to register, click here