SPTS Technologies are pleased to announce that we will be presenting at the International Wafer-Level Packaging Conference online event from 13 -30 October 2020.
Keith Buchanan, Manager, CVD Product Management, will be presenting, "Optimization of Low Temperature PECVD Dielectric Stacks for Via Reveal Passivation"
The presentation will be available on demand, throughout the conference period [in the 3D Integration Track].
IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.
For more information regarding the IWLPC conference please click here.