YAVNE, ISRAEL, November 27, 2017 | ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Omega® plasma etch system from Chengdu HiWafer Semiconductor Co., Ltd (HiWafer), China’s first pure-wafer foundry, to establish their new gallium nitride (GaN) on silicon carbide (SiC) production line. SPTS’s Synapse™ and ICP process modules on an Omega c2L platform will etch SiC backside vias (BSV) and GaN epitaxial layers to manufacture high power radio frequency (RF) devices. The high rate Omega system was selected over the competition because the Synapse provided superior SiC etch rates while the ICP module delivered improved selectivity for GaN etch.
“HiWafer is already a well-established Chinese foundry producer of gallium arsenide based pHEMT and HBT RF devices currently used in 4G communication, and they are an early adopter of SiC and GaN materials for use in high-end RF devices that target the worldwide 5G protocol,” stated Kevin Crofton, President of SPTS Technologies and Corporate Executive Vice President at Orbotech. “This leadership position is important as Power and RF applications are high on the ‘Made in China 2025’ agenda for promoting domestic production of semiconductor devices, and companies like HiWafer are well-positioned to contribute to realizing this national initiative. Our leadership in high rate etching of SiC and other dielectric materials will support HiWafer to provide manufacturing solutions for the coming 5G wave.”
Mr Nengwu Gao, General Manager of HiWafer, stated, “Orbotech’s SPTS Technologies is a recognized leader in compound wafer processing solutions to the global power and RF device industries. The addition of SPTS’s Omega plasma etch system gives us the tools to compete in GaN on SiC RF technology in telecoms and transportation applications, including railway systems. Acquiring this capability enables us to explore new applications and supports our ambitions to become a highly profitable and successful semiconductor foundry.”
About Chengdu HiWafer Technology Co., Ltd.
Chengdu HiWafer Technology Co., Ltd. is China’s first pure-wafer foundry service provider. HiWafer offers advanced GaAs integrated circuit manufacturing technology, and has well established 6-inch GaAs IC foundry production lines for pHEMT and MMICs. HiWafer also provides design and packaging services. For more information, visit http://www.hiwafer.com/en.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech's core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality ('reading'); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces ('writing'); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing ('connecting'). Orbotech refers to this 'reading', 'writing' and 'connecting' as enabling the 'Language of Electronics'. For more information, visit www.orbotech.com and www.spts.com.
Tally Kaplan Porat
Director of Corporate Marketing
Tel: +972 8 942 3603
Senior Director, Marketing Communications
Tel: +44 7951 203278