"Processes to Enable SiC and GaN Based Power and Optical Applications" R. Barnett
(SEMICON Taiwan 2019)
"Advances in doped AlN deposition techniques for next generation Piezo-MEMS" N. Knight
(SEMICON Europa 2018)
"Trends in Plasma Processes for SiC/GaN for Power Applications" R. Barnett
(SEMICON Taiwan 2018)
"Novel End-Point solution for improvement in Die Strength and Yields with Plasma Dicing (AG) in volume production" Jo Carpenter
(EPTC 2017)
"Plasma Dicing: The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die" R. Barnett
(Yole Dev. Tech Symposium 2017)
"Improving the productivity of Plasma Etch processing for PiezoMEMS applications" R. Barnett
(SEMICON Taiwan 2017)
"Fantastic Fan-Out. Improving interconnect productivity for the fastest growing packaging platform" A. Barker
(SEMICON West 2017)
"Plasma Dicing: Reducing the Cost of Singulating Thinner, Smaller Die" R. Barnett
(SEMICON SEA 2017)
"Extreme Wafer Thinning to 5μm for Low Cost Via-Last" D. Thomas
(SPTS/imec joint paper at 3D-ASIP 2016)
"Improving AlN & ScAlN Thin Film Technology for Next Generation PiezoMEMS" N. Knight
(SEMICON Taiwan 2016)
"FOWLP Goes Mainstream. PVD Solutions For The Fastest Growing Packaging Format" D. Butler
(3D Summit 2016)