This year the 2021 MEMS & Imaging Sensors Summit and the 3D & Systems Summit will be combining to form the Connecting Heteronegenous Summit taking place virtually from 1 - 3 September.
SPTS is a proud Platinum Sponsor of the event and will also be presenting:
Dr. Anthony Barker: Senior PVD Product Manager
Deposition and Etch Processing of Highly-Doped AlScN for Piezo-MEMS Applications
(Session 3.2) Wednesday 1st Sept, 16:15 pm
Dr. Dave Thomas: VP Product Management
Overview of Wafer Level Etch & Deposition Technologies for Hybrid Bonding
(Session 4.1) Thursday 2nd Sept, 14:55 pm
The MEMS & imaging Sensors Summit brings together thought leaders and industry experts from the entire MEMS and Imaging Sensors value chain to discuss the latest advancements in sensing technology and their work in driving innovation in high-end applications.
For more information click here.
The 3D & Systems Summit addresses the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.
For more information about the event please click here.