SPTS are proud to be Supporting Sponsors, and will be presenting, at the 17th International Conference on Device Packaging, taking place 12 - 15 April as a virtual event.
Richard Barnett, our Director Etch Product Management will be presenting Analysis and Management of the Effects of Fluorinated Gases during Plasma Dicing alongside David Parker from STMicroelectronics.
iMAPS Device Packaging Conference is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS), the conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.
We look forward to seeing you there! For more information please click here.