High Accuracy Inkjet Printing of 3D Underfill Dams Offers Greater Flexibility and Lower Cost of Ownership in Volume Production

YAVNE, ISRAEL | ORBOTECH LTD. (NASDAQ: ORBK), a leading provider of process innovation technologies, solutions and equipment enabling the transformation of the global electronics manufacturing industry, today announced that its Orbotech Inkjet™ 600 system has been selected by Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services.  By using Orbotech Inkjet 600 to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products, Amkor aims to maximize its manufacturing flexibility, increase its feature position accuracy and reduce its design-to-manufacturing lifecycle.

“Amkor’s use of Orbotech Inkjet 600 for 3D printing is a significant implementation of process innovation in high-volume semiconductor packaging,” said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “We are experiencing a great deal of interest in inkjet printing from the packaging industry, for applications ranging from underfill dams to package marking to the direct printing of isolation layers.  We believe that this may be the beginning of an industry trend towards adopting additive manufacturing solutions for seamless production processes. Our Orbotech Inkjet 600 offers device manufacturers unprecedented flexibility in product development, reduced cycle times and lower overall cost of ownership.”

“Amkor's emphasis is on functional integration and size reduction by using different package and interconnect technologies for System-in-Package offerings,” commented JuHoon Yoon, Amkor’s R&D Vice President in Korea. “By investing in solutions such as Orbotech Inkjet 600 for printing of underfill dams as opposed to conventional methods, we enable higher levels of integration in smaller form factors for our customers.”  

Underfill dams prevent leakage between active and passive components and are an essential process in SiP packaging for both device and sub-component substrates.  With its high-accuracy printing capability, the Orbotech Inkjet 600 enables the formation of tall underfill dams in a single step with real-time local alignment correction for tighter integration of components.  This not only leads to a shorter process by replacing existing cumbersome, subtractive processes, but also significantly lowers manufacturing costs.

Orbotech, together with SPTS Technologies, an Orbotech company, will be exhibiting at SEMICON West, Booth No. 1417 (South Hall) from July 12-14 in San Francisco.


About Orbotech Inkjet™ 600

Orbotech Inkjet™ 600 provides cost-effective, high quality additive printing solutions for IC packaging production.  Based on Orbotech’s advanced DotStream Pro Technology™, the Inkjet 600 prints fine lines and uniform thin layers at any angle and on a wide range of materials. Its sophisticated automatic measurements and scaling modes enable market-leading registration and accuracy. The Orbotech Inkjet 600 offers flexible, cost efficient solutions for IC packaging applications, including tall, high-aspect ratio 3D dams (ratio of 1:4), accurate isolation layers, IC units marking and serialization.


About Orbotech Ltd.

Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com and www.spts.com


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Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the so-called ‘Brexit’ process, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the final timing, outcome and impact of the criminal matter expected in mid- to-late 2016 and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean Matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2015, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.





Rami Rozen

Director of Investor Relations

Orbotech Ltd.

Tel: +972-8-942-3582



Tally Kaplan Porat

Head of Corporate Marketing

Orbotech Ltd.

Tel: +972-8-942-3603




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