The accelerated etch rates and superior components make the Xactix® X4 ideal for intensive R&D and pilot production. It is the leading XeF2 etch system for releasing MEMS devices.  

Key Benefits

  • Equipped with our patented dual expansion chamber design for high etch rates
  • Allows for high XeF2 gas flow and pressure without dilution from carrier gases
  • Provides both pulsed and continuous flow etch processes
  • Unique expansion chamber based design contributes to precise, repeatable pulse pressure and ease of mixing XeF2 with other gases
  • Customizable chamber size can be matched to the wafer size resulting in maximized etch rates, uniformity and efficiency
  • Easy to use, reliable and safe

Inquiry about: Xactix® X4 Series™

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